The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren’t just tools of transportation, but interconnected nodes within a vast network of software-defined mobility.

Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, electronic systems and subsystems. 

In a major push to advance the automotive chiplet ecosystem, Cadence and Arm have teamed up to slash development time, accelerate product innovation, and foster a new era of collaboration. This groundbreaking collaboration doesn’t just cater to the present needs of the automotive sector but also sets the tone for the future of mobility solutions.

This presentation will provide an overview of how the EDA tools and methodologies have evolved to address the challenges associated with advanced chiplet and multi-die package architectures.

Save your spot now, we hope to see you there!